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Design and Analysis Software(3d) - List of Manufacturers, Suppliers, Companies and Products

Design and Analysis Software Product List

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3D TCAD

Approach to Practical 3D Simulation

Three-dimensional process and device simulation using Crosslight's TCAD. The functions and mechanisms are introduced through various devices (CMOS image sensors, LDMOS, FINFET, DMOS, LIGBT) including mesh generation, device structure creation, and analysis. Additionally, simulation using GPUs is also introduced.

  • simulator

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Accelerating FDTD calculations with GPU

Improvement of processing speed in FDTD calculations using GPUs

The 3D lens structure and CIS 3D CMOS image sensor are picked up as benchmark examples. The GPU version of Crosslight's FDTD shows a 66-fold improvement in processing for 3D real device structures. The benchmark results achieved processing speeds equivalent to a Core i7 3930K PC with 10 clusters (equivalent to 60 cores) using an inexpensive GPU card.

  • simulator

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TCAD for power semiconductor devices

Analysis tool for power semiconductor devices using Crosslight Software's TCAD.

This introduces an overview of device simulations using LDMOS with a race track-shaped polysilicon gate and DMOS with a hexagonal polysilicon gate.

  • simulator

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Comparison tool for the presence or absence of multi-quantum barriers in LEDs.

Tool for comparing the presence or absence of multi-quantum barriers in LEDs.

Explaining the tunneling model of multiple quantum barriers (MQB) and superlattices (SL). Simulation comparison with and without superlattices (band diagram, L-I characteristics, internal quantum efficiency (IQE), electron leakage, etc.). Multiple quantum barriers increase the potential barrier for electrons and block electron leakage more effectively.

  • simulator

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Research tools for high-stress GaN devices

Research tools for high-stress GaN devices

This explains the theoretical model of GaN multi-quantum wells (MQW) under high stress. It is possible to obtain the following results for GaN device LEDs grown on silicon in arbitrary crystal orientations using the CrossLight device simulator. The tensile stress from the silicon substrate reduces the band gap of the multi-quantum wells (MQW) and results in a longer wavelength. There is a decrease in piezoelectric charges within the multi-quantum wells (MQW). The reduction in internal quantum efficiency (IQE) is caused by the increase in piezoelectric charges at the electron blocking layer (EBL) interface.

  • simulator

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Die casting design and analysis software 'CAST-DESIGNER'

Rapid gate system design and CAE analysis with a single software.

"CAST-DESIGNER" is software equipped with both gate system design CAD functions and analysis functions. It enables the adjustment of appropriate gate systems and processing conditions in a short time. Additionally, it includes the analysis software "GEO-DESIGNER," which allows for rapid initial stage analysis, enabling design concepts that avoid defect risks at an earlier stage than gate design.

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  • simulator
  • Other analyses
  • Other CAD related software

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